The next-gen Qualcomm Snapdragon 845 chipset has been announced at the Qualcomm Snapdragon Annual Technology Summit going on in Hawaii.
Snapdragon 845 chipset is announced by the executive vice president of Qualcomm Technologies, Mr. Cristiano Amon and was shortly joined by the CEO of Xiaomi, Mr. Lei Jun to officially announce that the upcoming Xiaomi Mi 7 will be among the first line of devices to feature the Snapdragon 845.
Detailed hardware specifications of the Snapdragon 845 are not revealed during the event, however, Mr. Amon addressed that there will be another dedicated keynote event for the Snapdragon 845 launch.
For what we know, the Snapdragon 845 will share the 10nm process built from the current gen top of the line Snapdragon 835 and will also feature a new X20-type modem with Gigabit LTE support.
Also, the Snapdragon 845 is expected to feature AI capabilities and a dedicated NPU (Neural Processing Unit) as competing chipsets from Apple and Huawei already features the same. More on the features of the SD 845 will be known after the official keynote event.
Two new devices featuring the Snapdragon 835 are also announced during the event. The HP Envy x2 detachable and the NovaGo convertible 2-in-1 from Asus.