Realme is gearing up to launch its latest device, the Realme 11 Pro, which has recently passed the TENAA certification with model number “RMX3770” in China. The certification has provided some key insights into the device, including a circular camera module and a centered punch-hole curved display.
The Realme 11 Pro is expected to come with a centered punch-hole display with a curved screen. On the back, it will sport a circular camera module with the primary camera sensor placed in the center, accompanied by two secondary lenses on either side and an LED flash above them. The design of the camera module is unique, marking a departure from Realme’s previous rectangular camera modules.
Additionally, a leak from Digital Chat Station suggests that the Realme 11 Pro is expected to feature MediaTek’s latest Dimensity chipset with 5G and is likely to launch in May 2023. However, no further details regarding the specifications of the device have been revealed yet.
The device has cleared TKDN and Bluetooth SIG certifications, suggesting that it will support Bluetooth 5.2 connectivity and will be available in Indonesia. With the latest MediaTek chipset and the curved punch-hole display, the Realme 11 Pro is expected to deliver a premium user experience.
Realme has not officially announced the launch date of the Realme 11 Pro yet, but the TENAA certification indicates that it could be soon. Realme has been known for providing feature-rich smartphones at an affordable price point, and the Realme 11 Pro is expected to continue that trend.